% Ultra i 123 resist dashes dimensions obtained as a function of the energy exposure using Displacement Talbot lithography (DTL)
% Resist parameters: 240nm thick, baked at 90 degree Celsius for 90 seconds
% DTL Exposure parameters for the first exposure with the 800nm period linear grating mask: DTL gap of 200 microns, DTL range of 6.4 microns / exposure dose fixed at 50 mJ.cm-2 
% DTL Exposure parameters for the second exposure with the 1.2 micron period linear grating mask: DTL gap of 200 microns, DTL range of 15 microns
% Post exposure baked at 120 degree celsius for 90 seconds
% Developped in MF-CD-26 developper for 90 seconds at Room temperature




[exposure dose 1.2micron linear grating mask/ (mJ.cm-2)]	[dashes width size / (nm)]	     [dashes length size / (nm)]
			20						   120					270
			22.5						   112					250
			25						   100					220
			30						   100					210